Abstract
This paper presents analytical and computational models of adhesive joints constructed from anisotropic conducting materials. Such materials are becoming increasingly important in the construction of fine pitch interconnection, for example the assembly of surface mounted components to printed circuit boards, and are likely to find considerable application in silicon die attach as alternatives to current ‘flip chip’ technologies. The paper presents design models of the mechanical and low frequency electrical behaviour of typical materials and relates these models to manufacturing process parameters.
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