Abstract
The angular distribution of atoms sputtered from silicon under 1–10 keV Ar ion bombardment (normal incidence) has been studied experimentally and using computer simulation. It has been found that the angular distribution is overcosine in the whole energy range studied. This is connected with a high contribution of secondary knock-on atoms to the sputter flux (cascade sputtering). The simulated angular distributions are shown to be quite sensitive to the variation of the interatomic potential. The results obtained are compared with data from the literature.
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