Abstract
High density fluorocarbon plasma for silicon oxide etching has various ion and neutral species. Profile evolution modeling can provide understanding of many difficulties caused by the complexity of the plasma in etching. In this research we have measured etching and deposition rates as functions of ion impinging angle, sample temperature, which are necessary for profile evolution modeling of silicon oxide etching in inductively coupled plasma. Angular dependence of etching yield of oxide in fluorocarbon plasma shows very unique behavior unlike typical ion-induced chemical etching or physical sputtering. Ion-induced deposition model is suggested and tested.
Published Version
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