Abstract
Analytic approaches to the pull strength and the shear strength of SMT (surface mount technology) attached solder joints are studied by mathematical models. The predicted pull/shear strength of leaded ceramic quad packages was correlated with the experimentally measured data. The predictive models have been used for defining the design guidelines for selecting the optimum lead/pad configurations, the minimum solder volume, and the maximum component misalignment for fine-pitch SMT assemblies.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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More From: IEEE Transactions on Components, Hybrids, and Manufacturing Technology
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