Abstract
To analyze the effect of particle shape on deformational behavior in the cutting simulation process for metal matrix composites (MMCs), two 2D mesoscopic-based finite element (FE) models reinforced with randomly distributed circular and irregular polygonal particles were developed. Different material properties (metal matrix phase, particle reinforced phase) and the properties of the particle–matrix interface were comprehensively considered in the proposed FE model. Systematic cutting experiments were conducted to compare the differences between two modeling approaches with respect to particle fracture, chip formation, cutting force and surface integrity. The results show that the irregular polygonal particle model is closer to the microstructure of MMCs, and is better able to reflect the deformation behavior of particles. The simulation model with irregular polygonal particles is even able to capture more details of the impact caused by particles, reflecting variations in the cutting force in the actual cutting process. The initiation and propagation of microcracks is mainly determined on the basis of particle geometry and further affects chip formation. Both models are able to correctly reflect surface defects, but the irregular polygonal particle model provides a more comprehensive prediction for the subsurface damage of MMCs.
Highlights
Traditional metal materials are gradually being replaced by metal matrix composites (MMCs) in the fields of aerospace, automobiles, optical instruments and electronic packaging due to their excellent material properties, which include high specific stiffness, high modulus, greater wear resistance, etc. [1,2,3]
The mechanical properties of MMCs are affected by the geometric parameters of the reinforcing phase, such as the aspect ratios of TiB
The results showed that the surface quality and edge defects were mainly determined by the fracture forms of the SiC particles, including crushing, cutting through, fracture and pulling out from the metal matrix
Summary
Traditional metal materials are gradually being replaced by metal matrix composites (MMCs) in the fields of aerospace, automobiles, optical instruments and electronic packaging due to their excellent material properties, which include high specific stiffness, high modulus, greater wear resistance, etc. [1,2,3]. To study the chip formation mechanism and subsurface damage, Wu et al [30,31] established 2D and 3D microstructure FE models of Al359/SiC composites by comprehensively considering the dimensions and distribution of particles, the debonding of the particle–matrix interface, and the fracture of the matrix and particles. They converted microstructure images of MMCs into binary images, and described the practical structure on the basis of the image processing.
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