Analysis to the dynamic response of a functionally graded spherical microshell in consideration of fractional-order dual-phase-lag heat conduction and nonlocal effect

Abstract

Functionally graded materials (FGMs) stand as one of the most representative composite materials due to the superior thermal resistance in non-isothermal environment. On another front, the applicability of integer-order heat conduction models is increasingly questionable because the heat transfer shares the history-dependent property at time microscale. It is noted that the small-scale effect of elastic deformation has become significant due to the development of micro-devices. To capture the small-scale effect of elastic deformation and the memory-dependent effect of heat conduction in the FGM microstructures, as a first attempt, the present study focuses on developing a thermoelastic model by incorporating the fractional-order dual-phase-lag (FODPL) heat conduction model and the Eringen’s nonlocal model. Moreover, the extension of the Caputo definition, i.e., the Tempered-Caputo (TC) definition of fractional derivative ruling out singular kernel is adopted to depict the memory-dependent effect of the heat conduction. Then, the modified model is used to investigating the dynamic response of a FGM spherical microshell subjected to a sinusoidal thermal-mechanical loading. The corresponding governing equations are formulated and then solved by Laplace transform techniques. Some parametric results are demonstrated to display the influences of the fractional-order parameter, the nonlocal parameter and the power-law index on the considered physical quantities.