Abstract
Finite element analysis (FEA) was used to model the thermally-induced warpage of a printed-circuit-board (PCB) assembly having an array of pin-through-hole (PTH) connectors during a dual-wave soldering process. The estimates of board warpage were compared with experimental measurements, and it was concluded that the model is capable of representing assembly deformation during and after wave soldering. Subsequent parametric studies of the effects of different PCB and connector material properties have resulted in general guidelines for the selection of these properties.
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