Abstract
Photoelastic methods are used to analyze the stress intensity factors and crack trajectories for subsurface cracks that are relevant to the process of wear particle generation. The specimen represents a half-plane with a shallow subsurface crack oriented parallel to the boundary. A concentrated load is applied to the boundary of the half-plane in close proximity to the crack tip. Three different series of experiments were conducted and results for the stress intensity factors for both the opening ( K I ) and shearing ( k II ) modes were determined. The mixed-mode stress intensity factors were combined to give the magnitude of an effective stress intensity factor which drives the subsurface crack. It was determined that the magnitude of K II was much smaller than K I . The relative signs of K i and K II , which depend on the location of crack tip with respect to the point of load application, were used to predict the crack trajectory.
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