Abstract
The investigation of the flux spattering in dependency on surface roughness of the substrate was conducted in order to decrease reliability issues during reflow soldering caused by insulating character of flux residues. Sample boards with matt and glossy solder mask, HASL and ENIG surface finish and two types of SAC305 lead-free solder paste with different flux chemistry (ROL1 and ROL0) were used in the experiment. The number of the flux residues, their area and the area of flux spreading around a soldering pad were evaluated by the image analysis. The dependency of the flux spattering on flux spread was found. The use of glossy solder mask instead of matt solder mask reduced the number of flux residues by approximately 50%.
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