Abstract

Tight integration of capacitive micromachined ultrasonic transducer (CMUT) arrays with integrated circuits can make active impedance matching feasible for practical imaging devices. In this article, negative capacitance-based impedance matching for CMUTs is investigated. Simple equivalent circuit model-based calculations show the potential of negative capacitance matching for improving the bandwidth along with electrical power transfer and acoustic reflectivity, but the model has limitations especially for acoustic reflectivity evaluation. For more realistic results, an experimentally validated CMUT array model is applied to a small 1-D CMUT array operating in the 5-15 MHz range. The results highlight the difference between electrical power transfer and acoustic reflectivity as well as the tradeoffs in signal-to-noise ratio (SNR). According to the results, ideal negative capacitance termination matched to the CMUT capacitance provides the broadest bandwidth and highest SNR if acoustic or electrical reflections are of no concern. On the other hand, negative capacitance and resistance matching to minimize acoustic reflectivity provides both lower reflection and closer to ideal SNR as compared with electrical power matching. It is observed that acoustic matching also reduces acoustic crosstalk and improves array uniformity. While several challenges for integrated circuit implementation are present, negative capacitance-based impedance matching can be a viable broadband active impedance matching method for CMUTs operating in conventional and collapsed mode as well as other ultrasound transducers with mainly capacitive impedance.

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