Abstract
In order to study the influence mechanism of coupling effect on 3C-SiC material removal process under nanometer conditions, the repeated scratches of different abrasive grains, machined surface morphology, dislocation distribution, grinding force and abrasive wear were analyzed by molecular dynamics method, and the geometric characteristics and damage distribution of machined surface under the coupling effect of dual abrasive grains, as well as the influence rule of coupling effect on surface/subsurface characteristics were obtained. This study is of great significance to understand the mechanism of 3C-SiC removal in nano-scale grinding process, and is helpful to guide the preparation of fixed abrasive polishing discs.
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