Cutting performance and tool wear in laser-assisted grinding of SiCf/SiC ceramic matrix composites

Abstract

Ceramic matrix composites have high hardness, so their machining requires high grinding forces that cause severe wear of the grinding head. To investigate this problem, the present study investigated the cutting performance of conventional grinding (CG) and laser-assisted grinding (LAG) of SiCf/SiC ceramic matrix composites using electroplated diamond grinding heads. Firstly, a three-dimensional transient heat transfer model based on a Gaussian heat source was developed to observe the surface and internal temperature field distributions of SiCf/SiC ceramic matrix composites subjected to laser irradiation. Secondly, the effects of laser heating temperature on the workpiece surface on the grinding forces were analysed. It was found that the axial and feed grinding forces were more than 40% lower under LAG than CG due to the removal mechanism of the SiC matrix changing from brittle fracture to ductile fracture and the oxidation reactions occurred in the SiCf/SiC ceramic matrix composites. Thirdly, the material removal mechanism was analysed by observing the morphology of machined surfaces, which showed that ductile removal from the SiC matrix occurs during LAG. Finally, it is also founded that the mean height of exposed abrasive grains from machined surface was reduced by 1.02 μm, 12.52 μm in LAG and CG respectively. The forms of wear caused by abrasive grains were studied. Under CG, the abrasive grains mainly exhibit cleavage fractures; while under LAG, micro-abrasion is the main wear form.