Analysis of Mode II debonding behavior of fiber-reinforced polymer-to-substrate bonded joints subjected to combined thermal and mechanical loading

Abstract

This paper presents a set of closed-form solutions for Mode II debonding process of fiber-reinforced polymer-to-substrate bonded joints subjected to combined thermal and mechanical loading. Six different bond–slip models are considered in deriving the closed-form solutions. For each bond–slip model, explicit expressions for the debonding load, effective bond length, interfacial shear stress, interfacial slip as well as the load–displacement response are presented. Provided the bond length is sufficiently long, the debonding load depends only on the interfacial fracture energy and the temperature variation. A temperature increase leads to an increase in both the debonding load and the effective bond length, and the rate of increase of the latter depends on the bond–slip model of the interface.