Abstract
The mesoscopic stress and strain states of Bi2223/Ag/Ag-alloy superconducting compositetapes have been studied both analytically and experimentally under bending deformation.The tapes used in the present study were supplied as the standard samples for the VAMASround-robin program (classified as VAM1 and VAM3). Detailed tape bending analysis wascompleted based on a damage-free initial state, and the calculated decrease of critical current,Ic, due to Bi2223 filament fracture was compared to the experimentalIc decrease. Thecalculated Ic was much lower than that obtained in the experiments for both tapes. Metallographyindicated the presence of delamination in as-received as well as bend-tested tapes. Theanalysis was therefore modified to include delamination and it was completed for the casewhere delamination occupied the full width of the tape mid-plane. The calculatedIc with delamination was higher than the experimental results for both tapes. Delaminationoccupying partial width of the mid-plane explained this difference. Finally, the width ratiowhere delamination exists was calculated by comparing the analytical results withdelamination and experimental results. This ratio increased with increasing curvature ofthe tape.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
