Analysis of interfacial crack initiation mechanism of thermal barrier coatings in isothermal oxidation process based on interfacial stress state

Abstract

In this paper, the interfacial stress state is used to analyze the interfacial crack initiation mechanism of the thermal barrier coatings (TBCs) during isothermal oxidation. The influence of thermal growth stress, initial residual stress, and creep behavior on the stress distribution is considered to have an accurate simulation result. A parameter that integrates the effects of interfacial normal and tangential stress is modified for evaluating interfacial crack initiation. It is found that, in the cooling stage, the interfacial cracks sprout at the top coat (TC)/thermally grown oxide (TGO) interface valley region and the TGO/bond coat (BC) interface peak region, which agrees with the experimental results. Furthermore, the influence of interfacial roughness on crack initiation is investigated. The result shows that different interfacial roughness affects the sprouting region of interfacial cracks and cracks within the TC layer.