Analysis of interconnect and package structures using PEEC models with radiated emissions

Abstract

The PEEC (partial element equivalent circuit) approach is well suited for the modeling of integrated circuits and system interconnect and packages. In this paper, techniques which incorporate the latest enhancements of the PEEC approach are applied to EMI and electrical interconnect and package (EIP) example problems. Our approach corresponds to a full wave solution, which accurately determines the high frequency and also the time domain currents and voltages. Two examples are given to illustrate the usefulness of the techniques for both transient and frequency domain electromagnetic simulation as well as for radiated field calculation.