Abstract
Recently, high-pitched noise emanating from solid-state drives (SSDs) is becoming an important issue. By contrast to hard disk drives, SSDs have no mechanically moving parts so it has been considered that noise doesn't occur in SSDs. However, some customers and industry insiders bring up an acoustic noise issue from SSDs. According to previous studies, vibration of multilayer ceramic capacitors (MLCCs) soldered on circuit board can be transferred to circuit board and this may lead to acoustic noise generation. Therefore, in this study, noise generation mechanism was studied considering multiple MLCCs' operation and their location with simplified rectangular printed circuit board (PCB). Based on the results, it was found that MLCCs soldered on SSD circuit board are the main noise source by performing modal tests. And it was verified through experiment that noise can be reduced by removing problematic MLCC from PCB.
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