Abstract
The article presents the results of the analysis of heating of printed circuit conductors of printed circuit boards mounted on a metal base, on-board device of spacecraft when pulsed current flows through them. Thermal transient and impulse characteristics of a system consisting of a printed conductor and a printed circuit board are considered. The analysis of the dependence of the temperature rise rate of printed conductors and the duration of transient processes on the linear dimensions of the system elements is given. It is noted in the article that the time of transient processes most strongly depends on the thickness of the layer of insulating materials. All the results were obtained in the process of modeling transients in the ANSYS 2019 R1 Transient Thermal module. Practical recommendations on the consideration of thermal transients in printed conductors in the design of printed circuit boards are given.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
