Abstract
Abstract Multi-chip topology is widely adopted for large rated current power modules. Thermal management of multi-chip power modules has a significant impact on their long-term reliability. The transient thermal network model used for thermal management relies on the time response of junction temperature, which is estimated using temperature-sensitive electrical parameters (TSEPs) derived from the temperature dependency of I-V characteristics in power devices. However, the parallel connection of power devices complicates the junction temperature estimation because the sensing current is shared unevenly due to differences in the I-V characteristics of individual devices and the temperature gradient within the power module package. Consequently, the temperature estimated using a unified TSEP does not accurately represent the temperature difference among parallel-connected power devices. This paper investigates an error in the junction temperature estimated by using unified static TSEP for parallel-connected silicon carbide (SiC) Schottky barrier diodes (SBDs) as the power device. The results reveal that the unified TSEP underestimates the maximum temperature in multi-chip power modules. However, the semi-physical model of power devices enables us to estimate the junction temperature of each SiC SBD when we measure shared currents for each device.
Published Version
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