Abstract
AbstractMicro-Electrochemical Grinding (ECG) is a process that produces a component with dimensions in the range of tens of nanometers to few millimeters. In this process, the material is removed by both electrochemical and abrasive action in a small interelectrode gap. Components produced by the micro-ECG process have found application in the electronics and medical industry. There have been some researches regarding the contribution of electrolytic action in the removal of material in cylindrical micro-ECG. The study of turbulence of electrolyte flow in a gap is required. This paper presents a turbulent flow modeling and analysis of surface micro-ECG to show the effect of erosion in material removal. The shear stresses generated on the workpiece surfaces are used to find the shear forces acting on the workpiece boundary. It was found that the shear stresses or shear force increase with an increase in the wheel rotation for a fixed interelectrode gap. The material removal rate by the erosion process was calculated and the theoretical values were validated previous research findings.KeywordsMicro-machiningShear stressMRRCFD simulationShear force
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