Analysis of Electric Explosion Performance of Ni/Cu Multilayer Foil

Abstract

AbstractMultilayer film is widely used in mechanical, optical, electronic, computer, sensor, recording, aerospace and weapon applications. In the thin‐film energy conversion device, it is desirable to use film to convert more energy. This work investigated the electric explosion performance of Ni/Cu multilayer films that were prepared by using the electrodeposition method. The cross‐section SEM image verified the layered structure of Ni/Cu multilayer foil. The metal in the Ni/Cu multilayer film grew in polycrystalline. The temperature of exothermic reaction in the Ni/Cu multilayer started at 1056 °C. We measured the current and voltage curves of foils with different bridge area. The combination of Cu and Ni in multilayer could improve the initial resistance of foil. The deposited energy of Ni/Cu multilayer foil with a bridge area of 0.4×0.4 mm was 105.57 mJ while the bridge area of 0.3×0.3 mm was 93.05 mJ at charging voltage of 3000 V. Compared with Cu foil, Ni/Cu multilayer foil with bridge area of 0.4×0.4 mm burst earlier and deposited 10.5 mJ more energy. As a result, when the modulation cycle of Ni/Cu multilayer film is 200/300 nm, the Ni/Cu multilayer foil with a bridge area of 0.4×0.4 mm has potential application in exploding foil.