Abstract
Surface Acoustic Wave (SAW) RF-filters are essential components for wireless communication. Miniaturization and cost reduction are the main driving forces for the development of these components. Up to now the dominant technology to connect the miniaturized filters are solder bumps. For further miniaturization a technology to fabricate copper pillar bumps (CPB) on SAW RF-filters was developed and the second level reliability of the components was tested. In this paper the physical analysis of CPB interconnects with a high resolution FIB SEM and EDX will be explained in detail. We will also show results of this analysis including the formation of the intermetallic phases and the structure and the degradation of the Ni barrier layers.
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