Analysis of bonded piezoelectric materials with a crack perpendicular to the interface subjected to in-plane loading

Abstract

The plane problem for bonded functionally graded piezoelectric materials containing a crack perpendicular to the interface is considered when the material properties along x-axis vary in exponential form. The Fourier transform technique and dislocation density functions are used to formulate the problem in terms of a system of singular integral equations and obtained asymptotic analytical solution of crack-tip stress field. Numerical calculations are carried out, and the effects of crack geometric parameters on the stress intensity factor and the energy release rate are shown graphically.