Abstract
Photochemical machining (PCM) is generally employed to manufacture micro-geometries on the workpiece. This technique offers stress free machining to produce complex structures by etching of the workpiece. This etching process is governed by numerous process parameters such as concentration, temperature of etchant, as well as etching time. In this paper, optimization of values of these process parameters has been carried out to obtain desired results of response variables such as material removal rate (MRR), surface roughness (Ra), and undercut. In this experimentation, copper is taken as workpiece material. Experiments are designed by Taguchi’s design of experiments (DOE). Analysis of variance (ANOVA) is performed to examine contribution of each process parameter to overall process while optimization of multi-response variables is executed by using grey relational analysis (GRA).
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