Abstract
A 2-D thermal-electric coupling model has been developed, which enables us to evaluate the current distribution of monolithically integrated light-emitting diode (MI-LED). Based on the experimental IR images, the current distributions have been evaluated for the MI-LEDs on two types’ heat sinks. For the MI-LED on poor thermal conductive chip-on-board heat sink, although there is a large junction temperature variation of 40 °C all over the chip, the current only varies from −16% to 11% due to the high parasitic series resistance and the topological design of MI-LED. The experiments show that the impact of the heat-crowding-induced uneven current distribution on the wall-plug efficiency is negligible at a power density of 1 W/mm2. The average junction temperature is still the dominant issue. With a high thermal conductive copper heat sink, the average junction temperature could be suppressed below 50 °C, and there is no obvious heat crowding and uneven current distribution observed.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
