Abstract

Halo implanted MOSFETs exhibit anomalous behavior in drain current power spectral density (SID) of flicker noise (1/f) with the variation in drain voltage, but this behavior cannot be captured by existing 1/f models. To identify the reasons for this abnormal behavior of 1/f noise, we have performed experimentally calibrated technology computer-aided design (TCAD) simulations. We find that this anomalous behavior comes from the drain-side halo region, and it has complex dependence on the bias and geometry. We propose a sub-circuit model for 1/f noise that successfully captures the anomalous behavior of SID with the drain bias. This model calculates the individual contributions and the impact of different device regions, such as the source side halo, channel, and drain side halo, on the overall noise of the device. The proposed model is in good agreement with the experimentally calibrated TCAD simulations for different geometries, biases, and temperatures. The proposed model is also validated with the measurement data.

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