Abstract
Materials characterization, using surface analysis and depth profiling techniques, plays a vital role in all aspects of semiconductor technology from basic research to manufacturing. The techniques are: SEM/EDX/WDX - Scanning Electron Microscopy/Energy Dispersive X-ray/Wavelength Dispersive X-ray AES - Auger Electron Spectroscopy ESCA - Electron Spectroscopy for Chemical Analysis SIMS - Secondary Ion Mass Spectrometry RBS - Rutherford Backscattering Spectrometry LIMS - Laser Ionization Mass Spectrometry Chemical and elemental analysis of the first several atomic layers of a surface are performed. Detection limits range from less than a part per million to several atomic per cent, and areas of analysis can be as small as 5000 Angstroms in diameter. SEM capabilities provide topographical information at magnifications up to 200,000x. An overview of these surface analysis techniques will be presented with an emphasis on the wide range of applications in the semiconductor industry. Recent advances in one technique in particular, ESCA, will be discussed.
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