Abstract
The article provides a review of the state-of-art non-destructive testing (NDT) methods used for evaluation of integrated circuit (IC) packaging. The review identifies various types of the defects and the capabilities of most common NDT methods employed for defect detection. The main aim of this paper is to provide a detailed review on the common NDT methods for IC packaging addressing their principles of operation, advantages, limitations and suggestions for improvement. The current methods such as, X-ray, scanning acoustic microscopy (SAM), infrared thermography (IRT), magnetic current imaging (MCI) and surface acoustic waves (SAW) are explicitly reviewed. The uniqueness of the paper lies in comprehensive comparison of the current NDT methods, recommendations for the improvements, and introduction of new candidate NDT technologies, which can be adopted for IC packaging.
Highlights
As the sizes of electronic circuits are miniaturized from μm to nm, the speed and capacity of integrated circuit (IC) packaging has been improved dramatically [1]
This paper aims to provide an overview on the past and current non-destructive testing methods dealing with the structural integrity of IC packaging
Additional methods used for IC packaging inspection include magnetic current imaging (MCI), infrared microscopy time reflectometry (TDR)
Summary
As the sizes of electronic circuits are miniaturized from μm to nm, the speed and capacity of integrated circuit (IC) packaging has been improved dramatically [1]. The demand towards smaller size in the packaging has made the IC packaging, one of the fastest-growing technologies over the past half century [2]. As the sizes are getting smaller, the IC packaging are getting more complex, more challenging manufacturing processes are developed and more faulty and damaged packaging are produced. Based on the current trend, there is a growing demand for more advanced, reliable and robust inspection and testing methods. Non-destructive testing (NDT) has played a crucial role in the integrated circuit (IC) packaging industry, and the relevant research has been conducted intensively since the early1970s [3]. The NDT methods for integrated circuit packaging inspection can be divided in three major categories:
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