Abstract

The current study aims at performing the thermodynamic analysis of three different scenarios of the heat sinks numerically using the finite volume method (FVM). To this effect, heat sinks are made of aluminium to provide cooling for an electronic chip. In this respect, the three cases examined throughout this study are as follows: One with one layer and two with two layers flowing in different directions, counter-current, and parallel. The parameter’s analysis of the present investigation consists of three solid volume fractions (Φ) up to 3% for Reynolds number ratio (Rer) in the range of 0.25 ≤ Rer ≤ 2. Their imprints have been highlighted on frictional, thermal, and global entropy generation, the first law of thermodynamics and exergy efficiency, heat transfer, and pumping power. The findings revealed that the first law and exergy efficiencies are higher in the single-layered heat sink. However, the effect of solid volume fraction and Reynolds number ratio on these efficiencies is minimal. On the other hand, the double-layered heat sink generates less entropy than the single-layered one, which may be reduced by raising the Reynolds number ratio and solid volume fraction. Finally, the findings show that the heat transfer is higher in the double-layered heat sink but is accompanied by a considerable rise in pumping power.

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