Abstract
Abstract An overview was given to Coffin-Manson (C-M) methodology, fracture mechanics technology, and their applications to the fatigue lifetime prediction of solder joints in electronic packages, and their limitations were analyzed as well. An empirical relation of fatigue cracked area growth rate vs hysteresis energy rate was introduced to predict the fatigue lifetime and the strengthening directions of solder joints. To predict the strengthening directions was to predict the failure mechanisms. The predicted fatigue failure rate-controlled factors tell us that the TMF failure of Pb-Sn solder joints is determined by Sn matrix fracture capacity associated with subgrain structure and persistent slip bands. The Pb-phase fracture capacity is smaller as indicated by the propensity of Pb-phase cracking at me intermediate temperatures. The fatigue cracking resistance of the grain and interphase boundaries is high at higher temperatures and larger strain ranges. A fatigue lifetime prediction system was in perspective.
Published Version
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