Abstract
A die-attach material based on an Sn-coated Ni core-shell powder with a high re-melting temperature can be used for high-temperature applications. The outer Sn layers of the Sn-coated Ni particles possess a low melting point of 232 °C and can be completely converted into a Ni3Sn4 intermetallic compound with a high re-melting point of 794.5 °C after reflowing at a low temperature of 250 °C for 40 min. This die-attach material exhibits an excellent high-temperature operational capability, with a high shear strength of 40.2 MPa at 500 °C. The coefficient of thermal expansion (CTE) of the reflowed preform is between those of SiC and Cu, which is highly beneficial for mitigating the stress caused by the CTE mismatch between these materials. In addition, the thermal conductivity of the bondline is sufficiently high for heat dissipation during operation.
Published Version
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