Abstract

The Fourier-series-based insulated-gate bipolar transistor (IGBT) model has been very effective in simulating its switching behaviors and meanwhile, reflecting carrier dynamics. However, in turn-on process, such a model has difficulty in distinguishing the boundary between undepleted area and depletion layer of the drift region due to Gibbs phenomenon and therefore, cannot accurately describe the carrier behavior of carrier storage region (CSR). In this study, the Fourier-series-based model is modified to determine the more precise depletion layer edge for turn on. This is achieved by utilizing the actual characteristics of the carrier concentration gradient at the edge of CSR in turn-on process. Such a modified model is implemented in MATLAB/Simulink and it can better reflect the depletion layer and simulate the distribution of both the carrier concentration and electric field during turn-on process. It corrects the unreasonable voltage tail caused by the error of drift region voltage calculation in previous models. The results of the proposed model under both the resistive load and inductive load are in good agreement with TCAD. Such a modified model can more accurately simulate both carrier dynamics and switching behaviors in the turn-on process.

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