Abstract
To enhance the electrical conductivity and optimize the morphology of inkjet printed circuits, the response surface method was used to study the effects of Baseboard temperature, Scanning speed, number of layers, and their interactions on Wire width and resistance of printed circuits. Then the regressive equations of the line quality and the analysis of the variance of processing factors on the targeted response were determined. Finally, the optimized results are verified through an additional experiment. Results show the influence of the processing factors on the Wire width and resistance in the following order: Baseboard temperature > several layers > Scanning speed and several layers > Scanning speed > Baseboard temperature, respectively. The optimized parameter configurations are as follows: Baseboard temperature: 57.7 °C, Scanning speed: 1092.3 mm/min, and the number of layers is 2.76. The relative error between the precited data and the measured values is within 5%, which can provide a powerful and valuable reference for selecting processing factors in real manufacturing.
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