Abstract
This paper investigates about the thermal characterization of Solid glass micro-sphere (SGM) filled epoxy composites. SGMs of different sizes are embedded in epoxy resin to fabricate composites by hand-layup technique. The composites for various SGM content ranging from 0 to about 35 vol % are thus fabricated and the effective thermal conductivities (keff) of the composites are estimated. The theoretical values are then compared with keff values obtained from the experiment. This study shows that the incorporation of SGm results in an improvement in thermal insulation capability of the polymer. Further, the influence of size and content of SGMs in the extent of reduction of keff was studied. Also, the effect of void content on improving insulation capability of the composites was analysed.
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