An Electromechanical Model and Simulation for Test Process of the Wafer Probe

Abstract

With the fast development of IC (integrated circuit) packaging industry, IC test is becoming more and more important, especially the probe test of the wafer packaging. Based on experimental data and theoretical analysis, an electromechanical model is first proposed to describe the characteristics of the testing process of wafer probe to understand the behavior of micro-probe testing process, and to simulate the whole physical process. The model consists of a dynamic mechanical model, a dc electro-mechanical coupling model and an ac impedance model, which is used to analyze the overall physical properties of the probe test process and has a good agreement with the experimental data. Based on the electromechanical model, a simulation platform is established first, which will provide a simulation tool for the design of the microprobe and setting of multiparameters.