Abstract
This paper presents the design, fabrication and tests of an electro-magnetic vibrating ring gyroscope based on a control system and SOI-MEMS technology. The control system, including variable gain control (VGC), drive-frequency control and regulation module, is designed to improve mode matching. In device fabrication, and buffered hydrofluoric acid (BHF) solution is used to remove the buried oxide layer and release the suspended spring. Meanwhile, a compensate disk and negative photo resist (AZ303) coated on the backside of the wafer are employed to weaken the Lag and Footing effects during through-wafer etching process. The design of the gyroscope is optimized by FEA simulation and the fabricated devices show a rather good performance.
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