Abstract
This study introduces an innovative wet etching method for magnetron sputtering lead zirconate titanate (PZT) thin films, leveraging a solution of HBF4 as the etchant and HCl for intermediate product removal. Compared to traditional dry etching techniques, the focus is on improving cost efficiency and etching performance. Wet etching offers numerous advantages, including lower costs, faster etching rates, minimal lateral etching, and smoother etch profiles, making it a viable alternative for fabricating MEMS piezoelectric devices. The effectiveness of this method was substantiated through the production and performance assessment of a 1D scanning mirror, demonstrating that the wet etched PZT retained its piezoelectric properties and was efficiently integrated into MEMS applications without adverse effects on its piezoelectric functionality. Results confirm that this wet etching approach not only maintains the structural integrity of PZT films but also supports the manufacturing of MEMS devices with precise dimensional control and reliable operational performance.
Published Version
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