Abstract
This study inspected and tracked the location state of a test object in the telemetry monitoring of a wafer or solar panel, and the relevant optoelectronic devices. A CCD camera, triggered by the proposed system, captures the test target image in real time, which is transferred to the system for low-pass filtering, image binarization, spatial masking, boundary tracing, and other means of image processing. The new edge point detection algorithm is then applied to identify the edge points of three parallel lines. Three different group edge points are determined using the edge point detection algorithm, and the three groups are computed using a single linear regression equation. Multiple-linear regression is conducted to obtain the sections of straight lines of the groups that can best satisfy the expected requirements. Finally, whether the detection results are consistent with the expected requirements is determined to inspect whether the test object is consistent with the process specifications in order to reduce undesirable losses, as caused by inappropriate placement angle in subsequent manufacturing, thus, enhancing subsequent manufacturing to achieve high yield.
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