Abstract
Multichip module (MCM) technology has been expected for high speed and high density packaging. Authors have developed an 8 x 8 ATM switching module with clock speed of 622 Mb/s and power consumption of 60 watts by using MCM-C technology with low temperature co-fired ceramic (LTCC) substrate. This paper will discuss MCM packaging technologies for an ATM switching module.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have