Abstract
Modular multilevel converters (MMCs) are widely used in grid scale power electronics. Due to the presence of a dc component in the arm current, the MMC submodules (SMs) show an unbalanced current loading profile. This may lead to some semiconductor chips being more stressed than others, significantly affecting the overall reliability. To level the junction temperatures and improve the SM reliability, this article proposes an asymmetrical power module design in line with the loading profile, allocating more chips to higher current parts. This is shown to be realistic if the power flow is unidirectional. The concept is investigated using simulation backed by experiment. It is shown that the designed power module can significantly reduce the maximum temperature and the total power loss can be reduced by 5%–8%. The chip utilization rate is also improved. The proposed module is applicable in a certain range of power factor and modulation index adjustment. This article provides a guidance for optimum design of the power module for the SMs in an MMC.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
