Abstract
This paper reports a 4 × 4 element array tactile sensor with ‘silicon box’ structure. The sensory elements of the tactile sensor are made of piezoresistive single-crystal silicon diaphragms. This sensor is fabricated by an SiSi direct bonding technique and one-side processing technology fully compatible with current MOS technology. The array tactile sensor and CMOS signal-processing circuits are integrated on the same chip. The structure, circuit, processing and experimental results of the device are described in detail.
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