Abstract
The overview of electronic assembly publications shows that almost all authors concentrate on mass-scale (industrial) lead-free soldering. On the contrary there are almost no publications concerning possibility of manual soldering using lead-free solders and VOC-free fluxes. Manual soldering of SMD is widely used during PCB prototyping, especially at home or academic laboratories. European Union directive RoHS forbids to use in electrical and electronic equipment hazardous materials such as lead (Pb), mercury (Hg), cadmium (Cd), hexavalent chromium (Cr6+), PBBs (polybrominated biphenyls) and PBDEs (polybrominated diphenys ethers). The practice shows that in manual soldering SnPb solder and rosin is commonly used, damaging health of people who use it. The aim of this study is to check possibility of ldquodomestic userdquo of lead-free solders and VOC-free fluxes. The test will be held using different lead-free solders, VOC-free fluxes and various soldering conditions. SMD passive elements will be used for the tests due to its susceptibility for overheating (usage of lead-free solders enforces higher temperatures). The test will evaluate visual assessment of joint quality, analysis of PCB damage and degradation of passive elements parameters after manual soldering.
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