Abstract
Abstract In this article, a cost effective and simple method called line patterning is used for patterning of metal thin films deposited onto flexible substrates. Silver, gold and copper thin films have been deposited onto plastic substrates such as polyester, overhead transparency, polyimide and polyether imide and patterned via line patterning method. It was observed that the all metal thin films were electrically conductive and highly adhesive. Morphology of chemically deposited thin metal films was tested using scanning electron microscopy. Room temperature DC conductivities, current densities and power dissipation of these metal films have been investigated.
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