Abstract

Packaging related performance and reliability aspects of the advanced power modules were discussed. A new approach for the packaging of high performance power devices for both commercial and military applications was introduced. The resistance of device package was modeled. The results of closed form solutions and finite element analysis (FEA) were presented. The metalization and patterning of the first level package was discussed. The thermal performance of a typical power module with various heat spreader materials and configurations was analyzed by using 3D FEA techniques.

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