An adaptive laser processing method of multilayer heterogeneous materials by monitoring dynamic spectrum at kHz-MHz level

Abstract

Laser micro/nano processing exhibits significant advantages in manufacturing capability and performance. However, the properties of ablated materials cannot be sensed and identified during processing is an intractable challenge. In particular, multilayer heterogeneous materials often evolve into excessive residues and damages during laser selective removal. In this study, we developed an adaptive laser processing method that includes material interface adaptive and laser power adaptive for selective removal of multilayer heterogeneous materials by monitoring dynamic spectrum at kHz-MHz level. The mechanism of interface sensing and the threshold of laser selective removal of multilayer materials were investigated. Dual-channel parallel detection mode of the blazed grating with the ultrafast photodetector at the kHz-MHz pulse level has been designed and verified for monitoring adjacent layers synchronously. High-speed signals with a pulse width of 30 ns and a repetition frequency of 0–15 MHz were identified by the Field Programmable Logic Gate Array (FPGA), and pulse-level closed-loop feedback was finished. Patterned selective removal on an FR-4 copper clad laminate (CCL) and flexible printed circuit (FPC) was completed. The method exhibited sensitive signal characteristics, accurately sensed the material interface, and provided a clear criterion for identifying the removal process of multilayer materials by quantitative analysis of signal variation, which provides an innovative scheme for laser intelligent manufacturing of multilayer heterogeneous materials.