An Accordion-Folding Series-Fed Patch Array With Finite Thickness: A folding technique for CubeSat arrays

Abstract

Combining antenna arrays with physical reconfigurability (i.e., origami) allows for additional degrees of freedom in operation and enables larger structures to be folded into smaller volumes. The packaging ability of origami antennas is of great interest for CubeSat applications in particular. However, traditional origami is based on the manipulation of thin sheets, making physical reconfigurability with thick substrates very difficult. In this article, we present a foldable series-fed patch array designed on a strictly rigid printed circuit board (PCB). Notably, the array does not require any external mechanical folding appendages (i.e., brackets, tapes, or offsets), and it can be manufactured using commercially available PCBs and equipment. The PCB itself is strategically cut to form lamina emergent torsion (LET) joints. When fully deployed, the array operates at 5.7 GHz. A significant shift is not seen in the operational frequency until the folding exceeds 60° (5.7–5.61 GHz). This shows that the array, even in a state of near extreme faulty deployment, will operate as intended. An 8 × 6 prototype array was fabricated using a Rogers DiClad 880. When fully deployed, the array is extended in a surface area of 280 × 198 × 1.524 mm and can be folded into a 35.5 × 198 × 12.5-mm compartment. The array held its integrity well after 100 cycles. (One cycle starts at a state of full deployment, moves to a state of being fully packaged, and goes back to a state of full deployment.) Measurements show that the active reflection coefficients are in good agreement with the finite array simulations. The measured realized gains at 5.7 GHz for 0° and 30° folds were 22.4 and 21.4 dBi, respectively. At the 60° fold, a realized gain of 20.6 dBi was achieved at the frequency of 5.61 GHz.