Abstract

AbstractFlexible electronic devices have garnered increasing attention for their applications in wearable devices, biomedical systems, soft robots, and flexible displays. However, the current sensors face limitations regarding low sensitivity, poor stability, and inadequate adhesion bonding between stimuli‐responsive functional materials and flexible substrates. To overcome these challenges and enable the further development of sensor devices, surface modification of stimuli‐responsive materials with amyloid aggregates has emerged as a promising approach to enhance functionality and create superior multifunctional sensors. This review presents recent research advancements in the flexible sensors based on protein amyloid aggregation. The article begins by explaining the basic principles of protein amyloid aggregation, followed by outlining the process of preparing 1D to 3D amyloid‐based composite materials. Finally, it discusses the utilization of protein amyloid aggregation as a surface modification technique for developing flexible sensors. Based on this foundation, we identify the shortcomings associated with protein amyloid aggregate composites and propose possible solutions to address them. We believe that comprehensive investigations in this area will expedite the development of high‐performance flexible sensors with high sensitivity, high structural stability, and strong interface adhesion, especially the implantable flexible sensors for health monitoring.

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