Abstract

The continuous copper thermal-diffusion network of graphite flakes (GFs), aluminum sheets (Als), and Al particles (Alp) was prepared via chemical plating methods. After the vacuum-pressure infiltration process, Cu coatings contacted with other components forming three dimensional thermal diffusion pathways. The prepared Als@Cu/Alp@Cu/GFs@Cu/Al composites exhibited high effective thermal transfer properties. Moreover, the thermal conductivity (TC) of the Als@Cu-2/Alp@Cu/GFs@Cu/Al composite showed the optimal value of 542.66 W/m·K, which was larger than the pure Al matrix about 2.30 times. In this study, the innovative preparation method could be applied to fabricate aluminum-based composites with better thermal diffusion performance.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.