Aluminum addition to Sn-3Ag-0.5Cu-1In-xAl alloy effect on corrosion kinetics in HCl acid solution

Abstract

This study examines how adding aluminum to the SAC205-1In-xAl solder alloys in a 1 M hydrochloride acid HCl solution affects their corrosion behavior. HCL acid has a faster corrosion rate than other electrolytes because it contains chlorine (Cl−) and hydrogen (H+) ions. In contrast to other electrolytes like salt and alkaline solutions, which only have one type of ion species for causing corrosion, The characteristics of the produced solder alloy samples were investigated using SEM and EDX tests. Corrosion potentials were shown by polarization investigations, adding 0.3, 0.5, 0.7, 0.8, and 0.9 wt% Al to the SAC205-1In solder alloy. Based on polarization analyses, the produced solder alloys exhibit slightly different corrosion potentials when Al is added in comparison to the corrosion potentials of SAC305 and SAC205-1In. Corrosion rates exhibit a pattern whereby adding 0.8 wt% Al reduces the corrosion rate. However, as less aluminum is replaced with tin, the corrosion rate slightly increases. SAC205-1In's corrosion rates were enhanced by the addition of Al.