Abstract
There are some instances in which a DIP type IC is damaged by frictional electrification in the manufacturing process. To ground the IC is one of the means of protecting it from electrostatic damage, although it is not perfect. It is believed that decreasing the contact area between the DIP type IC and other objects is effective in reducing the charging of the IC. The effective area and the time of contact are expected to decrease if the contact point between the IC and the other object is vibrated. A DIP type IC was passed through a slideway vibrating at a frequency of 22 kHz. The charged level of the IC was found to decrease. The present method of applying ultrasonic vibration to reduce the electrification of the DIP type IC could be used in the manufacturing process.
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